Ryzen
Packaging
Branding
Marketing
Packaging
Concept
School Project
2022
Summary
This was a packaging design project for an existing brand of AMD lined GPUs and CPUs. The design challenge was to choose a company that we fancied and design packing around their brand and products. The company I chose was AMD and there two product lines was Ryzen their CPU line of Products and Radeon their Graphics Card of Products
Solutions
AMD has just announced their brand-new CPU line the Ryzen 5000 series for productivity and gaming with their new Zen 3 architecture with four new models within this new product line. With this new line of processors AMD has requested new packing for these new CPUs and GPUs that bring new life to this new groundbreaking line of products to help refresh the brand and bring a new look the brand. With that being said the design description was to blow up the number five to really sell and solidify the new CPU and really grasp the customer’s attention to this new box. Part of the challenge was creating packaging digitally being this was in the middle of the pandemic. For my packaging design concept, I decided to use maya to 3D render my ideal packaging idea why creating interesting corners and patterns for the shapes of the packages and adding raised text for flair.
